Medical MEMS, Sensors and 3D Printing: Frontier in Process Control of BioMaterials
Curators: Aviva Lev-Ari, PhD, RN and Adam Sonnenberg, BSc
1Executive Summary
As with all paradigm-shifting technologies, the development, adoption, and economic impact of 3D printing will depend not only on technological innovation and market forces but also on the legal considerations that guide those forces. Some, such as law scholar Deven Desai, view 3D printing as a Napster for material science, with the capacity to undermine scarcity — and therefore business models based on material distribution — in the same way that peer-to-peer file sharing has helped to disrupt traditional media industries. Others, such as Adam Rodnitzky, the director of Marketing at 3D scanning manufacturer Occipital, cast doubt on this assessment, comparing 3D printed objects to “a Grateful Dead concert tape that’s been duped a hundred times”: lesser-quality facsimiles that augment rather than diminish the value of scarce originals.
These concerns are only a part of the larger debate surrounding 3D printing, which is forcing legislators and regulators to rethink a broad range of legal issues, from patents to copyrights to liability. Below, we will briefly review a few of these legal issues with the greatest potential to shape the future of this market.
Featured image source: Sebastien_B
SOURCE
http://research.gigaom.com/report/legal-challenges-and-opportunities-for-3d-printing/
3DXTech Sticks Carbon Nanotubes Into Your 3D Printer’s Feedstock
In March, we covered a company that wants to stick its carbon nanotubes into your 3D printer’s feedstock. It turns out that they’re not the only ones keen to show you their nanotubes. 3DXTech is a Michigan-based startup that has developed a whole range of filaments for FDM/FFF 3D printing, including one line that’s chock-full of carbon nanotubes for carbon reinforcement.
3DXTech has already released a few different standard and speciality filaments for 3D printing. The first on their list is their iOn™ High-Performance ABS/PA Alloys, which combines ABS with Nylon for the best of both worlds. The company promises that it prints like ABS, but with better thermal, mechanical, and chemical performance. iOn High Performance ABS/PA Alloys are said to have “higher thermal resistance, superior impact strength, and improved solvent resistance.”
3DXNano is the company’s ESD carbon nanotube line. The carbon nanotube reinforced ABS filament can be used to 3D print components with electrostatic discharge protection, such as parts that may be used for integrated circuits. Due to the material’s ductility and consistency, as well as increased strength, 3DXNano can be used to 3D print objects for more performance-based applications, such as in the auto, industrial, and semiconductor markets.
And, to accompany all of its filaments, 3DXTech has released its 3DXMax HIPS support material. This can be used for multi-headed 3D printers to create support structures dissolvable in d-Limonene, for easy clean up. The HIPS filament is perfect for both the company’s speciality filaments, as well as its standard ABS and PLA filaments.
Finally, if you’ve had a taste of their nanotubes and are eager for more experimentation, you can sign up on their website or like them on Facebook to get access to the materials still in the R&D stages. They’ve tested these materials to ensure that they print, but have yet to introduce them in full to their online store. You could be that one, lucky customer to test out an FDM/FFF filament that will change the world of 3D printing forever before anyone else does.
Source: 3DXTech
http://www.3dxtech.com/3dxnano-esd-abs-cnt-3d-printing-filament/
http://3dprintingindustry.com/2014/05/08/3dxtech-sticks-carbon-nanotubes-3d-printers-feedstock/
A Simple, Low-Cost Conductive Composite Material for 3D Printing of Electronic Sensors
Jeongmin Hong, Editor
Abstract
3D printing technology can produce complex objects directly from computer aided digital designs. The technology has traditionally been used by large companies to produce fit and form concept prototypes (‘rapid prototyping’) before production. In recent years however there has been a move to adopt the technology as full-scale manufacturing solution. The advent of low-cost, desktop 3D printers such as the RepRap and emoH@baF has meant a wider user base are now able to have access to desktop manufacturing platforms enabling them to produce highly customised products for personal use and sale. This uptake in usage has been coupled with a demand for printing technology and materials able to print functional elements such as electronic sensors. Here we present formulation of a simple conductive thermoplastic composite we term ‘carbomorph’ and demonstrate how it can be used in an unmodified low-cost 3D printer to print electronic sensors able to sense mechanical flexing and capacitance changes. We show how this capability can be used to produce custom sensing devices and user interface devices along with printed objects with embedded sensing capability. This advance in low-cost 3D printing with offer a new paradigm in the 3D printing field with printed sensors and electronics embedded inside 3D printed objects in a single build process without requiring complex or expensive materials incorporating additives such as carbon nanotubes.
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC3504018/
http://journals.plos.org/plosone/article?id=10.1371/journal.pone.0049365
MEMS and sensor technologies for medical wearable applications
The medical MEMS and sensor market size is currently approximately $2.4 billion. Medical MEMS and sensors enable applications where it is advantageous to miniaturize components and systems due to form factor, integration and cost considerations. Furthermore, many applications are newly enabled by MEMS and micro-sensor technologies and would not be possible at all without miniaturization.
One of these exciting application segments is medical wearables. While early wearable solutions and prototypes have existed for more than a decade, this segment has been rapidly accelerating its development in the recent past. Enabled by small and cost effective sensors and micro-components, medical wearables are well positioned to be the key driver for enhancing our quality of life while reducing healthcare costs.
We are glad that you were able to join us — by attending this exciting event you will be able to identify emerging technology and application trends, listen to insightful talks, exchange ideas, network with your industry peers, and perhaps even form new companies!
Conference Topics
- Medical wearables: application trends, business and economic drivers, case studies, challenges, and opportunities.
- Worldwide healthcare trends: market drivers, demographic factors, government policy effects.
- Business aspects: fundraising, reimbursement, technology transfer, regulatory compliance, company formation, recruiting, and market research.
- Digital health: wireless devices, body area networks, online services, genomics, and personal genetic information.
- Sensors: pressure, thermal, radiation, flow and magnetic sensors used in medical devices as well as implanted systems.
- Diagnostics: portable assaying and sample preparation of blood, urine, cells, tissues, bodily fluids. For example, microfluidic and lab-on-a-chip devices to diagnose diseases in portable instruments and smaller sized bench top systems.
- Health screening: preventive medicine such as early detection of cancer through consumer, over-the-counter devices that are to be used on a day-to-day basis.
- Individualized treatment: integration of diagnostics with therapy and treatment on portable, smart lab-on-a-chip devices; for example, treatment is to be specifically based on the exact disease variation as well as the patient genotype and current health factors.
- Drug delivery systems: both transdermal and implanted techniques; for example, micro needles that provide convenience and precisely measured amounts of dispensed drugs. Smart, MEMS based drug delivery systems also enable continual drug delivery monitoring and improve patient compliance.
Sensing technologies for early identification of diabetic foot ulcers
David Goodman, MD, MSE
Co-founder and CEO
FeetFirst
Diabetes is the leading non-traumatic cause of lower extremity amputations in the US. Many people with longstanding diabetes experience nerve damage that results in loss of sensation in the feet, predisposing them to diabetic foot ulcers. These ulcers typically develop insidiously as people at risk have no way to identify the subtle changes that occur in the progression of a foot ulcer until it is obvious and usually advanced to the point that heroic measures (i.e invasive and expensive) are needed to save the foot, if it can be saved at all. Over the years, a variety of non-invasive technologies have been employed in an effort to develop a biomarker that can easily and reliably identify subtle and early changes in the foot that can trigger low cost interventions to prevent a foot ulcer from developing. This talk is focused on a review of these approaches and how they can be incorporated into the digital health ecosystem. Sensing technologies to be highlighted include pressure and thermal mapping as well as hyperspectral, near infrared, colorimetric and visible RGB photographic imaging.
Biography: David is the co-founder and CEO of FeetFirst, a digital health startup that is committed to making diabetic foot ulcers a thing of the past. Starting with co-inventing many of the early innovations in pulse oximetry and then later in remote disease management and now in digital health, David has been fortunate throughout his career to have positively impacted countless people around the world while delivering substantial returns to investors through innovations that he helped to invent. David’s energies are now devoted to combining his expertise in biomedical sensing with the basic building blocks of digital health to create novel and scalable non-invasive biomarkers that enable better health at home as well as in the doctor’s office. David holds a BAS in applied science and bioengineering and a MSE in bioengineering from the University of Pennsylvania. David also received an MD cum laude from Harvard Medical School and the Harvard-MIT Division of Health Sciences and Technology. David completed his internship at the University of California, San Francisco (UCSF) in the Department of Medicine. He holds 18 issued and 4 pending US patents and maintains clinical practices in California and Hawaii.
MEMS technology: key innovation driver for wearable medical devices
Mehran Mehregany, PhD
Director, Case School of Engineering San Diego
Case Western Reserve University
Use of sensor-enabled wearable wireless health solutions to monitor the health condition of chronic disease patients is key to the quality of life of the patient and to reduction of cost of health care – by keeping the patient out of the hospital and emergency rooms. Chronic diseases account for 75%+ of the US health care expenditures. Monitoring for early intervention is key to avoiding long-term adverse outcomes for those at risk of developing chronic diseases. This presentation will elaborate on the important role that MEMS sensors play in enabling wearable, health monitoring solutions. Capturing data is the key to such solutions, which requires sensors of various modalities. MEMS sensors have the advantages of miniaturization, integration and batch fabrication – driving size, performance and cost advantages.
Biography: Mehran Mehregany received his PhD in Electrical Engineering from Massachusetts Institute of Technology in 1990, when he joined Case Western Reserve University. Mehregany founded the Case School of Engineering San Diego in July 2007, and its Wireless Health and Wearable Computing programs in 2011 and 2014, respectively. He is the Director of Case School of Engineering San Diego and Goodrich Professor of Engineering Innovation. Mehregany has over 360 publications describing his work (including a recent textbook on wireless health), holds 20 U.S. patents, is the recipient of a number of awards/honors and has founded several technology startups. His research interests are sensors, micro/nano-electro-mechanical systems, silicon carbide technology and microsystems, wearables and wireless health.
Wearable sensors for greater visibility into dynamic phenotype
David Shaywitz, MD, PhD
Chief Medical Officer
DNAnexus
A key premise of precision medicine, and of the Precision Medicine Initiative, is that the integration of rich genomic and phenotypic information can improve care, inspire science, and drive the development of novel therapeutics. Wearable sensors, a foundational technology of digital health, can provide greater visibility into dynamic phenotype, and complement and dramatically extend the comparatively static and episodic information typically available from the electronic medical record. The increasingly granular assessment of real-world physiology is expected to enable refined patient segmentation, and help define the underlying molecular networks — though this ambition remains largely unrealized. Examples of efforts to integrate clinically-relevant dynamic phenotype with molecular biology in areas such as metabolism and respiratory will be examined. The potential application of other types of sensors, such as those assessing interpersonal interactions and degree of connectivity, will also be reviewed. Potential limitations, as represented by the pulmonary artery catheter experience, will also be discussed.
Biography: Dr. Shaywitz (Twitter: @dshaywitz) is chief medical officer of DNAnexus, a Bay Area company that provides a cloud-based enterprise platform for the management of genomic and other healthcare data. Dr. Shaywitz received his MD/PhD from Harvard and MIT, and trained in internal medicine and endocrinology at MGH. He gained subsequent experience in the Department of Experimental Medicine at Merck, the healthcare practice of the Boston Consulting Group, and at Theravance. He writes extensively about medical innovation, and is co-author, with Lisa Suennen, of “Tech Tonics: Can Passionate Entrepreneurs Heal Healthcare With Technology?” In 2015, they launched “Tech Tonics: The Podcast,” focused on “the people and passions at the intersection of technology and health.” Dr. Shaywitz is a co-founder of the MGH/MIT Center for Assessment Technology and Continuous Health (CATCH) program focused on integrating rich phenotypic assessment with genetic information to guide clinical care and inspire fundamental research.
Wearables for Parkinson’s disease: validating sensors and apps for targeted clinical applications
Joseph Giuffrida, PhD
President and Principal Investigator
Great Lakes NeuroTechnologies
Non-invasive wearable transdermal microsystems for continuous monitoring of bioanalytes
Anand Gadre, PhD
Director, Nanofabrication Research Facility
University of California, Merced
Wearable sensors and big data computing for mobile health: monitoring to interventions
Emre Ertin, PhD
Associate Professor
Ohio State University
SOURCE
Medical MEMS and Sensors 2015 Annual Conference and Exhibition April 29 – 30, 2015 Santa Clara, California
http://medicalmems2015.com/index.html
SPONSORS
Sponsorships for Medical MEMS 2015 are available. For further information and questions about sponsorships, please click here.
Gold Sponsor
http://www.cotorelay.com
Coto Technology, leader in small signal switching solutions, has emerged onto the MEMS scene with its recent release of the RedRock™ RR100 – the world’s smallest MEMS-based magnetic reed sensor. Recognizing the steadily decreasing size requirements of medical devices, and supported by nearly 100 years in relay and switch design technology, Coto Technology is gaining momentum within the realm of MEMS-based switch and relay design. The RR100 sensor offers all of the advantages of conventional magnetic reed sensor technology in a package measuring only 1.11mm3. Ideally suited to the demands of next generation medical applications, the sensor offers directional magnetic sensitivity, ESD resistance, and a robust wafer level package – all while consuming zero power. The RedRock™ RR100 has an increasing number of medical device applications including medical wearables, portable insulin pumps, capsule endoscopes, next generation hearing aids, insulin pens and other small, battery-powered medical electronic devices.
Silver Sponsor
http://www.roguevalleymicro.com
Rogue Valley Microdevices is a full-service precision MEMS foundry that combines state-of-the-art process modules with the engineering expertise to go seamlessly from custom design to manufacturing. Specializing in MEMS and biomedical device manufacturing, Rogue Valley offers a flexible equipment set and smaller batch sizes, playing a critical role in the commercial MEMS manufacturing ecosystem.
At Rogue Valley, we engage in open dialog with our customers, prioritizing your goals and needs every step of the way. We also share engineering-level data with customers, so you can bring up a process at Rogue Valley that you will later use for high-volume production at a larger fab.
Beyond our MEMS fab, Rogue Valley also maintains the broadest and most comprehensive set of wafer services commercially available.
Founded in 2003 and based in Medford, Oregon, Rogue Valley maintains a 200mm MEMS devices foundry. For more information, please visit: www.roguevalleymicro.com.
Program Sponsor
http://www.xfab.com
X-FAB is the world’s largest analog/mixed-signal foundry group manufacturing silicon wafers for mixed-signal integrated circuits (ICs). Its marketing network and client base span the Americas, Europe and Asia, offering manufacturing capacity of approximately 744,000 200mm-equivalent wafers per year. The largest specialty fab group, X-FAB is unlike typical foundry services because of its specialized expertise in advanced analog and mixed-signal process technologies.
X-FAB creates a clear alternative to typical foundry services by combining solid, specialized expertise in advanced analog and mixed-signal process technologies with excellent service, a high level of responsiveness and first-class technical support. X-FAB manufactures wafers for automotive, industrial, consumer, medical, and other applications on modular CMOS and BiCMOS processes in geometries ranging from 1.0 to 0.18 µm, and special BCD, SOI and MEMS long-lifetime processes.
Lunch Sponsor
http://www.imtmems.com
IMT offers the most complete MEMS foundry services in our fully automated 30,000 sq ft, 6” wafer fab. IMT’s extensive product experience includes DC and RF switching, drug discovery/delivery, microfluidics, cell sorting, inertial navigation, optotelecom, IR emitters, and others. IMT offers wafer bonding for both hermetic packaging/encapsulation and microfluidics including: fusion bonding, anodic bonding, glass frit bonding, Au-Au thermocompression bonding, metal alloy bonding and various types of polymer bonds. IMT’s wafer-level packaging and through silicon via technologies are production proven for the next generation 3D packaging and interposer applications. IMT is ISO 9001 certified offering complete turn-key foundry services from design through high-volume production. We bring our customers’ MEMS to volume production. Speak with an IMT representative to see how we can make your MEMS work for you.
Lunch Sponsor
http://www.micralyne.com
Micralyne is a leading independent MEMS and microfabrication foundry. We excel at creating process technology for complex MEMS devices and execute disciplined volume manufacturing. Micralyne extends its value to our customers by offering extensive packaging, testing, and design services, beyond a typical MEMS chip foundry. This Foundry Plus model has successfully produced products for industries such as: life sciences, aerospace, automotive, oil and gas, telecom, and industrial sensors. Micralyne offers our customers a strategic partnership with deep technical knowledge and fabrication capabilities. Our fabrication services fit their need by providing established process platforms and timely device fabrication through early prototype, qualification, and volume manufacturing.
Breakfast Sponsor
http://www.yieldengineering.com
Meeting the stringent demands of companies worldwide, Yield Engineering Systems, Inc. (YES) manufactures equipment with cost-effective solutions for wafer-level packaging/redistribution layers, bioMEMS, semiconductor industries and more. We manufacture high temperature vacuum cure ovens, polyimide cure ovens, silane vapor phase deposition systems, plasma etch and clean tools and vacuum bake/vapor prime ovens. Proven applications using these systems include silane substrate adhesion for microarrays, biocompatibility, stiction reduction, wafer dehydration and surface tension modification. YES has proven to withstand the test of time with products that increase yields, extend performance, and improve processes. All equipment is engineered, manufactured and tested in Livermore, California USA. The answer is YES to quality, flexibility, superior products and service. Visit us during the show at Booth #9.
Breakfast Sponsor
http://www.aseglobal.com
The ASE Group is the world’s largest provider of independent semiconductor manufacturing services in assembly and test. The group develops and offers complete turnkey solutions covering IC packaging, design and production of interconnect materials, front-end engineering test, wafer probing and final test, as well as electronic manufacturing services through Universal Scientific Industrial Co Ltd. As global leader, ASE provides a complete scope of services for the semiconductor market, driven by superior technologies, breakthrough innovations, and advanced development programs.
Association Sponsor
http://www.mems-exchange.org
The MEMS and Nanotechnology Exchange (MNX) has been providing services to the U.S. research community since 1999. We have completed over 2300 unique development and fabrication projects for our customers. We have thousands of MEMS and Nano process technologies available in our advanced processing facility, along with technical assistance from experienced and talented fabrication and process development engineers. MNX can provide a complete range of services to researchers who need a trusted partner at any project phase, including early-stage development, design and modeling, prototype fabrication, or transition to manufacturing. Contact us atwww.mems-exchange.org to ask how we can help you quickly and affordably transform your concept from prototype to production!
SOURCE
http://medicalmems2015.com/sponsors.html
Many thanks to our exhibitors from the 2013 event.
http://www.acam.de/products/picocap/applications/mems
acam provides intelligent ASIC solutions for MEMS sensors. The versatile solutions can be used with a variety of sensors (e.g. capacitive or resistive) and are well suited for portable medical devices thanks to the very low current consumption. The high resolution and measurement rate of the chips make them perfect for the use in high-end applications. The on-board processing capability in form of a microprocessor allows for compact sensor fusion, e.g. to make the linearization of a pressure sensor directly on chip.
acam is a privately owned company with its headquarter located in the south of Germany. A worldwide distributor network assures local support with offices in North America, Europe and Asia.
http://www.alphaprecision.com
Alpha Precision specializes in custom ultrasonic machining of wafers and high precision surface polishing for excellent anodic bonding for MEMS. The ultrasonic process results in high precision placement and tolerances of features on the MEMS wafer. Ultrasonic machining does not impart any substrate cracking, stress or temperature change. This process is applicable to many different brittle substrates such as glass and ceramic. End use features include through vias, cavities and grooves. ISO/TS 16949:2009 Certified Quality Process.
Alpha Precision also does specialty MicroBlast machining of many different shapes and sizes.
http://www.boschman.nl
Boschman Technologies is the world leading supplier of automatic molding systems that use film for the encapsulation of Sensor and MEMS devices. This process, called Film Assisted Molding is ideal for applications where sensing surfaces or bond pads or heat sinks must be exposed and free of mold compound bleed and flash. This technology is used for MEMS, Sensor, Solar, and Optical molding applications with the transfer molding of epoxy or silicone based mold compounds, including clear materials. In addition, Boschman serves as a one-stop shop for research, development, qualification, prototyping and small volume manufacturing services by focusing on MEMS, Sensors, and advanced IC and wafer level packaging applications. By working closely with customer R&D departments to explore new packaging concepts, value from Innovation to Industrialization is provided.
http://www.finetechusa.com
Finetech’s precision die bonders provide sub-micron placement accuracy and process modularity within one platform: thermo-compression/sonic, eutectic, epoxy, ACF & Indium bonding, sensitive materials (GaAs/GaP), UV curing. Ideal solutions for advanced technology applications: flip chip, laser bars & diodes, VCSELs, MEMs, sensors, detectors, 3D, W2W / C2W, photonics packaging, and micro-optics assembly.
http://www.ggba-switzerland.ch
The Greater Geneva Berne area is a Swiss economic development agency representing the interest of six Swiss cantons (states) in Western Switzerland: Berne, Fribourg, Geneva, Neuchatel, Valais and Vaud. Surrounded by France, Germany and Italy, our region offers a welcoming environment for companies to collaborate, develop and commercialize their technologies on an international scale. With our dense and sophisticated life science and microtechnology clusters representing nearly 5000 companies, more than 500 labs, and 120,000 workers, these sectors have converged to create an academic and commercial environment of international renown in the MEMS, sensors, and high-tech biomedical sectors.
Companies are drawn to our region because of the potential for synergies and close collaboration with our unique institutions such as the Swiss Federal Institute of Technology (EPFL) with 19 specialized labs in microtechnology, the Swiss Center for Electronics and Microtechnology (CSEM), the Swiss Foundation for Research in Microtechnology, our six cantonal universities, and our three University Hospitals of Berne, Geneva, and Lausanne.
Research is a top priority in Switzerland where more scientific publications and patents are filed per capita than anywhere else in the world. Our region’s above average spending on fundamental and applied research is the result of long-standing policies and initiatives to attract investment and collaboration in high value-added sectors.
We offer an accessible regulatory environment; an open clinical community; low taxes; an educated, multilingual, multicultural workforce; science parks and incubators; networking platforms; state-funded collaboration programs; and a world-class quality of life.
As a government sponsored association, our mission is to provide support and assistance to companies (MEMS, sensors, life sciences, etc.) interested in the benefits that Switzerland can bring to them. Our support ranges from facilitating relationships with potential partners to helping negotiate the regulatory environment to all aspects of establishing an enterprise in Switzerland. For more information, please contact Matt Julian at 512-301-3337 (office), 512-586-7035 (cell) or m.julian@ggba-switzerland.ch (email).
http://www.himt.de/en/home
Founded in 1984, Heidelberg Instruments is today a global leader in design, development and manufacturing of complex laser based maskless lithography systems. These systems are critical to fabrication of advanced photomasks and direct write solutions in the areas of Advanced Electronic Packaging, Flat Panel Display, MEMS, Integrated Optics and other micro and nano based applications.
Heidelberg Instruments’ customers include many of the major global nano and micro technology based corporations along with some of the leading research and development organizations that provide components used in an array of electronic, communication and information technology products.
Heidelberg Instruments is located in Heidelberg, Germany, with global customer support offices in Asia, Europe, and North America. The company is 100% privately owned by the management and employees.
http://www.kent.edu
Kent State University is internationally recognized for its biomedical research. Current research strengths across the many disciplines at Kent State are particularly compatible with the bioengineering fields of tissue regeneration, biomaterials, biocompatibility, sensors and implanted devices. Our researchers are developing transdermal implants for amputees, improving neural function with implanted electrodes, creating implanted sensors for monitoring blood chemistry and vital signs and designing drug delivery devices that can be implanted or worn on the skin. Our researchers are also developing new medical sensors using advanced organic and polymeric materials to measure biomarkers and other biochemical indicators of disease, injury and trauma. Other materials research focuses on improving the biocompatibility of materials, decreasing the risk of infection from implanted devices, producing Lab-on-a-Chip devices for diagnostic and therapeutic applications and creating a new generation of flexible electronic medical devices for implantation and other applications. Kent State is also known for its research strengths in flexible electronics and liquid crystals within its Liquid Crystal Institute™(LCI).
http://www.nordson.com
Nordson Corporation operates in more than 30 countries around the world delivering precision technology solutions to help customers succeed worldwide. The company engineers, manufactures and markets differentiated products and systems used for dispensing adhesives, coatings, sealants, biomaterials and other materials, fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing.
http://www.lnf.umich.edu
The National Nanotechnology Infrastructure Network (NNIN) is an integrated network of user facilities, supported by the National Science Foundation, serving the needs of nanoscale science, engineering and technology researchers across the country. The goal of the NNIN is to enable rapid advancement in science and engineering at the nanoscale by providing researchers with efficient access to nanotechnology infrastructure (fabrication, characterization and computational capabilities and facilities) and support from experienced staff members.
The Lurie Nanofabrication Facility (LNF) at the University of Michigan is one of the NNIN sites that offers 24/7 semiconductor processing capabilities on production-level equipment supported by a professional staff. With 1,160 m2 (12,500 ft2) of ISO class 4/5/6 and 7 (Class 10/100/1000 and 10,000) cleanrooms for processing pieces, 100 mm and 150 mm wafers, we have processing capabilities for silicon and organic devices, MEMs and bioMEMs, fluidics and biofluidics, and nanoimprint technologies.
With such an available suite of established technologies for a large range of applications, the LNF is ideal for rapid feasibility assessment of ideas and pilot/low-volume products. Whether you want to assess new process adjustments for your product without compromising your current process, explore new device directions, or simply take advantage of our advanced characterization capabilities, the LNF provides the complete cleanroom experience for your high tech needs. The LNF is also part of the National Nanotechnology Infrastructure Network (NNIN), an integrated network of user.
With over $20M in state-of-the-art equipment, we provide the training and experience that will turn your ideas into reality. A full list of available equipment and capabilities are available online athttp://lnf.umich.edu/index.php/capabilities.
Original Biomedical Implants, Inc. (OBI) was established in Texas with an initial focus of commercializing a new generation of dental drills and implants with a unique patented ultrananocrystalline diamond (UNCD) coating, which enables an order of magnitude superior performance over current products at competitive costs. After a return on investment (3 years), OBI will also commercialize high-revenue new generation medical devices such as MEMS drug delivery devices and biosensors, UNCD-coated prosthesis (e.g., hips, knees, stents), electrically conductive UNCD electrodes for neural stimulation, and much more. UNCD-based products will address the global health business which is projected to reach $365 billion per year in 2015 (Global Industry Analyst, February 2012).
http://rbbsystems.com
The Premiere Electronics Job Shop
At RBB Systems, we specialize in on-demand manufacturing of mission-critical electronic assemblies for the industrial, commercial, medical and military sectors. By embracing small batch custom assemblies of electronic circuit boards, we allow clients greater flexibility in meeting fluctuating market demands.
We combine the best lean manufacturing principles with a hungry can-do attitude. Our cost-effective, team-driven approach offers a meaningful alternative to offshore production. Our organizational mission is simple: We exist to move heaven and earth to get our small batch customers what they need, when they need it.
If you need low-volume printed circuit board assembly to support second-tier product lines or other small batch industrial electronics work, we invite you to contact us to learn more about our services, philosophies and capabilities.
http://www.roguevalleymicro.com
Specializing in MEMS and biomedical device fabrication, Rogue Valley Microdevices is a full service MEMS foundry that combines state-of-the-art process modules with the engineering experience and expertise to seamlessly go from custom design to device manufacturing. With our extensive list of process capabilities, all front-end processing is performed in house. Maintaining all MEMS process capabilities in house enables us to decrease manufacturing lead-times while improving device yield and performance.
Rogue Valley Microdevices offers over 50 unique MEMS manufacturing and thin film processes to support our worldwide customer base. Our MEMS and thin film processes are designed to handle silicon wafer substrates, as well as a variety of other material such as quartz, glass and aluminum nitride wafers. Our goal is to minimize process development time, keeping your cost and lead-time to a minimum. We have extensive MEMS manufacturing experience and understand how important it is to have a robust and repeatable process.
Rogue Valley Microdevices is based in beautiful Southern Oregon. We supply services to customers with a wide variety of applications, including those in MEMS, semiconductors, biotechnology and nanotechnology. To contact us, please go to: http://www.roguevalleymicro.com/contact.php.
http://www.semefab.com
Semefab is a volume foundry supporting an extensive process portfolio of MEMS, MOS, bipolar, opto-CMOS, ASIC and discrete technologies and supplies silicon wafers, die and packaged devices to the market. Semefab operates its own 6-inch and 4-inch volume foundries with complete autonomy between its MEMS and MOS/bipolar fabs.
Semefab also supports wafer and package test in its facilities. Supporting a commercialization business model, Semefab optimizes device structures and process flows within an ISO accredited environment and seamlessly transfers these into its volume foundries. As a global foundry, Semefab exports more than 74% of its fabricated product and ships more than 200 million die per year.
http://www.tecnisco.co.jp/en
TECNISCO, LTD. is a subsidiary of Disco Corporation, a worldwide manufacturer of dicing saws and grinding machines. They supply customized parts that are manufactured with Glass, Metal, Ceramic, or Silicon by its advanced high-precision processes and composite technologies for the MEMS industry. Tecnisco’s expertise includes: dicing, ultrasonic machining, sandblasting, milling (drilling), assembling (AuSn, AuGe, AgCuIn, AgCu), polishing, bonding, plating, sputtering, vapor deposition and more. Their target is to be a best solution partner from trial production to mass production.
http://www.tousimis.com
Tousimis manufactures highly reliable Supercritical CO2 Dryers. Our Critical Point Dryer (CPD) process technology eliminates surface tension forces enabling delicate 3-D micro structure preservation.
Current CPD applications include Biological, MEMS, Bio-MEMS, Aero Gel, Nano Particle, Carbon Nanotube, Graphene and others.
Tousimis also manufactures high purity fixatives and X-Ray Reference standards.
Tousimis is a USA based company supported via a global sales and service network.
http://www.uakron.edu/engineering/BME
Biomedical Engineering at The University of Akron is both patient-centered as well as student-focused. We seek to find solutions to pressing needs of the medical community, and we expect our students to be at the forefront of medical innovation. Within our department, we focus on three areas of specialization: Biomechanics, Biomaterials & Tissue Engineering, and Instrumentation, Signals & Imaging. Through these areas we strive to (i) better understand mechanisms of disease, (ii) develop improved technologies for diagnosing or treating diseases, and (iii) educate the next generation of biomedical engineers. Knowledge gained through this approach fuels the rapid expansion of our region’s biomedical sector.
SOURCE
http://www.medicalmems2014.com/exhibitors.html
How light could play a role in tissue engineering
http://www.photonics.com/VideoGallery.aspx?DCID=c83b7944ee4e4e7da95582d788f16210
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